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Profile Measuring Instrument Product List

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High-Power Laser NFP Measurement Optical System "M-Scope type H"

NFP measurement optical system for measuring the light beam profile of high-output lasers such as 5W class.

The "M-Scope typeH" is an NFP measurement optical system for measuring the light beam profile of high-output lasers in the 5W class. It employs a method where approximately 5% of the light beam emitted from the sample being measured is reflected by a beam sampler, and this reflected light is focused onto a two-dimensional image detector using an objective lens and an imaging lens. This allows for the accurate measurement of the light beam profile and shape of high-output lasers, and in combination with a fine motion stage, it is also possible to measure changes in the emission direction of the beam shape by moving the optical system in the focal direction. 【Features】 ■ Attenuates to an appropriate level for measuring the power of high-output lasers ■ Up to 20x magnification for observation optics ■ Standard equipped with a coaxial incident illumination port ■ Allows for microscope image observation and alignment using real images in combination with a coaxial incident illumination device (optional) ■ Enables the construction of a high-output laser NFP measurement system in conjunction with the optical beam analysis module AP013 *For more details, please feel free to contact us.

  • Laser Components
  • Other electronic measuring instruments
  • Other measurement, recording and measuring instruments

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Wafer Edge Profile Measurement Device

Conventional high-speed measurement capability about 10 times faster! It is possible to capture the shape of the edge in just a few seconds!

The wafer edge profile measurement device EPM-300 is equipped with a uniquely developed laser microscope that measures edge shapes with sub-micron accuracy. When combined with processes like CMP, it allows for the overlay and verification of edge shapes before and after polishing. It features a high-speed measurement function that captures profiles at approximately ten times the speed of conventional methods, enabling edge shape acquisition in just a few seconds. Additionally, it includes functions for roundness measurement, notch alignment, notch shape measurement, and image acquisition, with an option for measuring the cross-sectional shape of notches. Furthermore, in addition to 200mm and 300mm wafers, edge shape measurement for 450mm wafers is also available as an option, allowing for rapid verification of upcoming sample products.

  • Semiconductor inspection/test equipment
  • Wafer processing/polishing equipment
  • Image analysis software

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